PhD position - Superconductor Integration for thermal management of quantum computing and spatial multi-chip platforms

OPPORTUNITY DETAILS

Total reward

0 $

State University

CEA Tech

Area

Western Europe

Host Country

France

Deadline

31 Oct 2021

Study level

Doctoral Degree

Opportunity type

PhD

Specialities

Engineering , Information technology and computer science , Physics , Chemistry

Opportunity funding

Not funding

Eligible Countries

This opportunity is destined for all countries

Eligible Region

All Regions

SL-DRT-21-0411

RESEARCH FIELD

New computing paradigms, circuits and technologies, incl. quantum

ABSTRACT

As part of Quantum Silicon Grenoble project, teams at CEA-LETI, CEA-IRIG and Néel Institute aim at building a quantum accelerator with silicon spin quantum bits (qubits). Compatible with large-scale production, existing integration processes on Si are a real advantage for the scalability of these qubits. The extreme qubit operating conditions (cryogenic temperatures =1K, high frequencies in the range of a few GHz, high signal density) require the development of adapted technological building blocks. To interconnect the qubits and the controlled circuits, integration of superconducting metals is promising. Indeed, their vanishing resistance at low temperatures and the low thermal conductivity of superconductors also enables to protect the qubits from the heat generated by the control electronics circuits integrated close-by. Note that these developments will also benefit spatial applications sharing similar operating constraints. The thesis will focus on: 1) Studying the superconducting properties of Nb, NbN, TiN, Al and any combination of these materials during integration processes to optimize them for a single level of routing and multilayers pads. Establishing low temperature compatible thermal conductivity measurement set-up, protocol and sample design.2) Transferring the acquired knowledge in term of integration and thermal conductivities to develop the next generation of multi-chip platform hosting qubits and control electronics circuits. The PhD student will be part of the 3D integration and packaging lab of CEA-LETI (Grenoble) and will interact very closely with the Spectral-imaging laboratory for space science at CEA-IRFU (Saclay) for thermal conductivity measurements.